According to the bidding data of semiconductor process equipment of domestic mainstream 12 inch production line, among the 12 main types of semiconductor equipment, the highest localization degree of degumming equipment is 82.4%, and the localization rate of CMP, cleaning, heat treatment, etching, PVD and other equipment is close to or more than 20%. The localization of copper plating, CVD, measurement, ion implantation, lithography, glue coating and development equipment is still at a low level.

Source: excerpt from semiconductor industry weekly published by BOC securities on September 7, 2021

Source: semiconductor equipment and materials