It is understood that after adjusting the price of new and urgent orders in the fourth quarter of the year, the leading manufacturer riyueguang investment control has recently informed customers to increase the price by 5-10% in the first quarter of next year to cope with the rising cost of IC carrier plate and wire frame, as well as the market situation of short supply of production capacity. It is expected that after the price increases of riyueyue, Qibang and Nanmao, Huatai, Lingsheng and Chaofeng will follow suit. The legal person said that the packaging capacity was tight in the first half of next year, and the price adjustment was irresistible. We were optimistic that the sealing and testing plants such as riyueguang investment control and Chaofeng were operating well until the second quarter of next year.

 

The ban of Huawei in the United States has made it impossible for the sealing and testing plants to receive orders from Huawei Hisilicon after September 15. The capacity gap after Huawei's suspension of orders was originally expected to be filled after the second quarter of next year. However, orders from other customers have sprung up after September. After November, the production capacity of both wire laying and ball planting packaging is fully loaded and in short supply, including high-level cladding packaging, wafer level packaging and 2.5d/3d sealing There is also an obvious shortage of production capacity, sealing and testing industry almost call this situation incredible.

 

According to industry news, the sealing and testing factory has raised the price of wire rack and wire package in October due to the shortage of production capacity. The price of urgent and new orders are increased by 10%. After November, the ball planting packaging capacity is full, and the price of IC carrier board is increased due to shortage. Therefore, the price of new order has increased by about 20%, and the price of urgent order has increased by more than 20-30%. After the last ten days of November, the sealing and testing market has entered the traditional off-season. However, this year, it seems that the full capacity will not be relieved before the end of the year, and the tight packaging capacity will last at least until the second quarter of next year. It is imperative to increase the price by 5-10% in the first quarter of next year.

 

As the package is priced by quantity, the overall tight production capacity represents a new record of chip shipment. Industry analysis of the reasons, one is that the original backlog in the IC design plant or IDM factory wafer inventory, began to release to the packaging factory for packaging process production. Two, the novel coronavirus pneumonia epidemic led to the long distance business opportunities and the outbreak of the home economy, including the sale of pen and electricity, flat panel, WiFi devices, game machines and other products to the shortage. OEM plant and system factory will naturally increase the chip delivery volume.

 

Third, the automotive electronics market rebounded significantly in the fourth quarter, but the chip inventory had already bottomed out, so the vehicle chips were released in a rush. Fourth, compared with 4G mobile phones, the silicon content of 5g smart phones has increased by nearly 50%, which requires more packaging capacity support.

 

The manufacturers pointed out that the inventory of chip supply chain will shift back to the next stage, the resurgence of the epidemic situation will drive the business opportunities of long-distance and residential economy, the automotive electronic market will recover, and the generation of 5g mobile phones will change. These trends will last at least for the whole year of next year, so the packaging capacity will be in short supply until the middle of next year.